Gelid Solutions Accessories: GC-Pro Thermal Compound

GC-Pro Thermal Compound (TC-GC-PRO-A)

The GC-Pro is made from the purest thermal conducting materials and offers outstanding thermal properties. Thanks to nano scale produced ultra-fine molecular structure the GC-Pro fills spaces more effectively than conventional materials and therefore it provides uniform thermal contact with enhanced heat transfer properties. Created for professionals the GC-Pro thermal compound ensures the best-in-class performance for your CPU, VGA or Chipset heatsink applications. As with the other compounds of GELID Solutions the GC-Pro is non-electrical conductive, non-corrosive, non-curing, non-flammable and non-toxic. The GC-Pro also comes with a GELID applicator which enables an easier application.

Net Content: 5g

 

   

Density (g/cm3): 2.8
Net Content (g): 5
Thermal Conductivity (W/mK): 7
Viscosity (Centipoise): 170000

   
       
       
       

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